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Product Description
The HJ30J Series Micro Rectangular High-Speed Connectors are designed for high-density, high-speed board-to-board interconnections in chassis and cabinet-level applications, offering excellent electrical performance and mechanical reliability in harsh environments.
Key Atụmatụ
- Flexible stranded pin contacts for enhanced reliability
- High-density contact layout with 1.27 mm × 1.27 mm pitch
- Metal shielding shell for superior EMI protection
- Available in 7 shell sizes: 12, 18, 24, 30, 36, 55, 100 contacts
- Ideal for high-speed signal transmission between boards
Nka na ụzụ nkọwa
| oke | nkọwapụta |
| operating okpomọkụ | -55 ° C na-+ 125 ° C |
| Mgbochi njirimara | 100 ± 15 Ω |
| Rated dị ugbu a | 3 A |
| Kpọtụrụ nguzogide | ≤ 20 mΩ |
| Dielectric na-eguzogide voltaji | 800 V (okpomọkụ ụlọ) |
| Mgbochi imegide | ≥ 5000 MΩ (500 VDC); ≥ 100 MΩ (wet heat) |
| Ọnụego nnyefe data | Ruo 1.65 Gbps |
| Ndụ n'ibu | 500 mating cycles |
| Omume ọma jijiji | 10–2000 Hz, 196 m/s² |
| Ụjọ | 735 m / s² |
